We assemble printed circuit boards — surface-mount (SMT) and through-hole (THT). From a single prototype to a production series: component placement, reflow and wave soldering, inspection, and protective coating. One team, full traceability.
Surface-mount, through-hole, and everything in between. We place the parts, solder them, inspect them, and protect them — so your board arrives ready to work.
Send your Gerbers, BOM and pick-and-place files. We handle the rest — and keep you in the loop at every stage.
We check your data for manufacturability, flag risks, and return a clear quote and lead time — usually within 24–48 h.
Turnkey component procurement from authorised distributors with MOQ optimisation, or we work from parts you consign.
Laser-cut SMT stencil, solder paste print, and solder-paste inspection (SPI) to verify deposit volume before placement.
Pick-and-place for SMT, reflow oven, then THT population with selective or wave soldering and hand-finishing where needed.
AOI on every board, X-ray for BGA, and optional functional/ICT testing. Cleaning and conformal coating to finish.
ESD-safe packaging, full build documentation and lot traceability, shipped to you or drop-shipped to your customer.
FSS designs hardware and firmware in-house. That means we read your board like engineers, not just operators — and can take you from idea to populated PCB without handoffs.
Proven processes, the right inspection at the right step, IPC-class workmanship.
Gerbers, BOM and pick-and-place — we’ll come back with a quote, a lead time, and free DFM feedback.